No Time to Test the Water?

The materials and processes for lead-free really have come together at the last minute, in time to meet the RoHS deadline of 2006. You would be justified in feeling that you have hardly had time to think about what’s available. But now you need to press on with conversion to full-on lead-free production.

How do you know the materials you are considering will work together? How much of your lead-free knowledge will be applicable? Will it be easy to change materials or modify processes as you acquire more data?

We understand the uncertainties you face. That’s why we have created a range of lead-free solder pastes that is easy to understand, and easy to select the right paste for your requirements.

Take our Multicore® WS300 paste, for example: specifically formulated for excellent print definition at fine-pitches, MulticoreWS300 displays low voiding, superior slump resistance, and long open and abandon times for convenience and low wastage. Plus, you can clean boards in water up to three days after reflow, leaving no visible residue. Rest assured, our high-performance Multicore WS300 meets or exceeds ANSI/J-STD-004 and 005 specifications, as well as Bellcore GR-78-COREtests.

And You Don’t have to go In At The Deep End

If you are already using our Multicore WS200, going lead-free is a natural transition. Multicore WS200 specifically addresses the challenges of mixed lead-rich/lead-free assembly. The two formulations share the same flux chemistry, allowing you to migrate to Multicore WS300 - with a choice of 96SC (SAC387) or 97SC (SAC305) lead-free alloys - with minimal re-testing effort.