Even if You're Not Going to Lead-Free - It's Coming to You

Are you one of the unlucky few not required to go lead-free by 2006? Yes, unlucky - because while those who simply must make the transition are receiving the most attention, your challenges are not being addressed. But nothing has changed for you. You can just carry on as before, right?

Well it has. And you can’t.

For one thing, the surface finishes you are working with are changing, driven by the dominant market requirement for lead-free compatible materials. Are you noticing that your finely-honed reflow profile is suddenly producing poorer solder joints? Have you had to begin increasing the peak temperature, or total duration, to compensate? Are you battling higher defect rates and rework?

Sound familiar? This is what happens when lead-free compounds enter your processes. And there is little you can do to stop them. If you simply carry on as before, your soldering problems will get the upper hand.

But cheer up. We thought about you. What’s more - at Henkel - we understand your needs and we have solutions to your challenges.

Take our new Multicore® WS200 solder paste: Multicore WS200 combines a classic SnPb solder alloy, and high-activity, water washable flux that leverages our innovative science developed to address RoHS and WEEE compliance. You can trust WS200 to restore wetting performance and ensure high yield rates regardless of surface finish.

But one day, you will cross that bridge

Here is one more thing to consider: what happens when you do need to go lead-free? If you have already qualified Multicore WS200, moving to our closely-related lead-free Multicore WS300 paste is a snap.

With Henkel, all your bases are covered.