![]() |
||||||
With the European lead-free directives now less than a year away, electronics manufacturers everywhere are finding out exactly what it takes to comply. But what if you don’t have to adopt lead-free just yet? Can you sit back and observe from a distance? The answer is, quite simply, not at all. With such a diversity of conventional processes in widespread use, tin-lead solder is likely to interact during reflow with one or more lead-free finishes, causing subtle changes in the mechanism of joint formation. The higher temperatures required by lead-free alloys means that a standard tin-lead profile will not enable proper reflow. Incomplete wetting is a typical consequence, often leading to problems such as opens and voiding, and tempting assemblers to adjust the reflow profile, at the risk of exceeding the capability of most tin-lead pastes. So whether you need to go lead-free with your products and market sectors or not, you won’t necessarily get the choice. Solution: Multicore MP218 Thousands of manufacturers around the world already rely on Henkel’s solder formulations. With internationally recognised technical expertise, industry knowledge and comprehensive materials solutions, Henkel is best-equipped to meet every challenge presented by today’s changing market needs. Still not convinced? |
|
|||||