Another Step Closer to Lead-Free Paste Perfection

Everyone knows lead-free soldering works under laboratory conditions. No doubt your main assembly sites have been inundated with specialists, individually optimising your lead-free processes. But there is little real-world data or experience, compared to the accumulated knowledge surrounding lead-rich assembly. So how can you ensure that your processes will work outside of the lab?

If you’re using Multicore® LF318, you needn’t worry. We specifically formulated it for maximum repeatability and great results, in every environment. Multicore LF318 is extremely tolerant of high humidity, up to 80% – which can otherwise impair resistance to slump as a process is transferred to a manufacturing site in a more humid climate.

What’s more, this unique solder paste offers an extremely wide process window for both printing and reflow. Combined with a long abandon and open time, Multicore LF318 will streamline your processes and, perhaps more importantly, reduce your manufacturing costs. In short, Multicore LF318 has the power to transform the competitiveness of your operations.

World-Class Performance, World-Wide

Multicore LF318 is lead-free, halide-free, and no-clean. Superior slump resistance by IPC ANSI/J-STD-005 and JIS-Z-3284 standards minimises bridge defects. Superior tack life and open time exceeding 24 hours slash paste wastage. High initial tack force prevents component movement during high-speed placement. Plus excellent solderability on most any surface finish, including nickel/gold, immersion tin, immersion silver and OSP copper; in air or nitrogen. No-clean residues are soft, non-stick, and colourless, easing visual inspection and ICT probing.

Lead-free technology is still young. Multicore LF318 delivers the mature performance you need as a truly global player.